SAMTEC-SEARAY press-fit right-angle socket array provides increased design flexibility.

SAMTEC family of SEARAY Open Pin Field Arrays has expanded to include a right-angle socket with press-fit terminations for increased design flexibility and high retention. This socket is a high-density solution for micro backplane applications with Samtec’s Edge Rate contact system optimized for signal integrity.

Available in eight- and 10-row designs with up to 500 total I/Os on a .050″ (1.27mm) pitch grid, this SEARAY press-fit right-angle socket array (SEAFP-RA Series) delivers maximum grounding and routing flexibility, low insertion/extraction forces, and high cycle life. Optional guidepost holes aid in proper alignment when mating with SEARAY terminal arrays, which are also available in right-angle and press-fit terminations.

The featured Edge Rate contact system increases cycle life and minimizes the effects of broadside coupling, which decreases crosstalk for superior signal integrity performance and impedance control. This rugged contact system is also less prone to damage when “zippered” during unmating.

SEARAY products are the industry’s largest offering of high-speed, high-density, open-pin field arrays. They support 28+Gb/s applications and are also Final Inch-certified for breakout region trace routing recommendations to save designers time and money. SEARAY Open Pin Field Arrays (SEAM/SEAF Series) feature a .050″ x .050″ (1.27mm x 1.27mm) pitch grid and stack heights from 7mm to 40mm. SEARAY LP ultra-low-profile arrays (LPAM/LPAF Series) are available in 4mm, 4.5mm, and 5mm mated heights. For up to 50% board space savings, SEARAY ultra-high-density arrays (SEAM8/SEAF8 Series) feature a 0.80mm (.0315″) pitch grid with up to 500 total I/Os.
 Samtec’s SEARAY™ products are the industry’s largest offering of high speed, high density open pin field arrays. They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.


 
FEATURES:
Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
Performance up to 18 GHz/pair
Up to 500 I/Os in open pin field design
1.27 mm (.050") pitch and space saving 0.80 mm pitch
Rugged Edge Rate® contact system
Can be "zippered" during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Product™ (E.L.P.™) standards
7 - 17 mm stack heights
Vertical, right angle, press fit
85Ω systems
VITA 47, VITA 57, Pismo 2 certified
IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment
Electronic Products (SEAM/SEAF Series only)
IPC-A-610F, Acceptability of Electronic Assemblies – Meets Class 3 Acceptability Criteria for High Performance/Harsh Environment Electronic Products (SEAM/SEAF Series only)


SEARAY™ open pin field design gives customers the ability to simultaneously run differential pairs, single-ended signals and power though the same 28+ Gbps interconnect.
 
[By www.samtec.com News Release}